University of Idaho - I Banner
A student works at a computer

SlateConnect

U of I's web-based retention and advising tool provides an efficient way to guide and support students on their road to graduation. Login to SlateConnect.

Location

Department of Electrical & Computer Engineering

Physical Address:

Buchanan Engineering (BEL) 213
875 Perimeter Drive MS 1023
Moscow, ID 83844-1023

Phone: 208-885-6554

Fax: 208-885-7579

Email: ece-info@uidaho.edu

Next Generation Microelectronics Research Center

Reenergizing Semiconductor Workforce Development Nationwide

Building our professional semiconductor manufacturing workforce nationwide, the Next Generation Microelectronics Research Center (NGeM) provides world-class undergraduate and graduate education programs and research across the field of microelectronics.

University of Idaho College of Engineering students and faculty engage in industry-sponsored research projects funded by Micron, the National Science Foundation and U.S. Department of Defense, among others. Our graduates go on to careers that revitalize domestic memory chip manufacturing and mediate supply chain issues in the U.S.

Training and certificate programs offer integrated expertise in microelectronic device design, fabrication and packaging, cybersecurity, plant safety, and related technologies, such as semiconductor physics, electrochemistry, corrosion, and their applications for semiconductor industry.

The center provides an interdisciplinary workspace for STEM education across all disciplines in engineering and science.

Semiconductor Scholarships

Full-tuition scholarships available for students while pursuing our college’s semiconductor design and fabrication certificate programs

Learn More

Meet Our NGEM Director

Feng Li, Ph.D., P.E.

Micron Endowed Chair in Microelectronics, NGeM Director, FIB/SEM Director

Gauss-Johnson 217

208-885-7571

fengli@uidaho.edu

Campus: Moscow
Classes: Microelectronics I, Microelectronics I Lab, Electromagnetic Theory, Electromagnetics Lab, Signals and Systems I, Signals and Systems I Lab, Introduction to Electronic Packaging, Introduction to VLSI Design, Semiconductor Devices, Introduction to Microelectronics Fabrication, Senior Design I, Senior Design II
Areas of Expertise: Semiconductor device and IC design, Micro/nanofabrication and electronic packaging, ML/AI in VLSI design and manufacturing

View Full Profile

Location

Department of Electrical & Computer Engineering

Physical Address:

Buchanan Engineering (BEL) 213
875 Perimeter Drive MS 1023
Moscow, ID 83844-1023

Phone: 208-885-6554

Fax: 208-885-7579

Email: ece-info@uidaho.edu

Location

Department of Electrical & Computer Engineering

Physical Address:

Buchanan Engineering (BEL) 213
875 Perimeter Drive MS 1023
Moscow, ID 83844-1023

Phone: 208-885-6554

Fax: 208-885-7579

Email: ece-info@uidaho.edu